The MEMS Microphone Book Index

(draft 0.9, 02Dec2021)

 

-3dB point / frequency (see Low frequency roll-off frequency)

3GPP Idle Channel Noise Sending Test (p 214)

A-weighting (p 22, 33-34, 148-149, 226, 449-450)

Absorption (p 45-47, 50, 106, 132, 322)

Acceleration (p 490, 503, 505, 517, 532-533, 535, 553-558, 574)

Accuracy (p 76-77, 103, 117, 122, 133, 186-190, 201-203, 217-218, 227-228, 270, 278-283, 303-304, 316, 335-336, 492, 495, 536-537, 574)

Acoustic channel (Sound channel) (p 51, 66, 104-108, 195, 231, 239, 313-350, 360-364, 445, 483, 501, 547, 565)

Acoustic distance (p 75, 119-120, 351, 357, 444, 467)

Acoustic echo cancellation (see Echo cancellation)

Acoustic leak (p 100, 105, 159, 316-317, 328-335, 501, 505)

Acoustic MEMS sensor (p 247-259)

Acoustic overload point (AOP) (p 81, 128, 150, 165-169, 209, 222, 278, 289, 371, 374-375, 380, 410-411, 476, 487, 578)

Acoustic overload point measurement (p 209)

Acoustic sealing (Sealing) (p 234, 238-239, 314-316, 327-339, 341, 343)

Acoustic shock (p 182-184, 363, 435)

Acoustic sound pressure test (p 557)

Acoustical implementation (p 313-326, 328-339)

Active noise cancellation (ANC) (p 115, 123-124, 163, 188, 225, 310, 381, 389, 395, 397)

ADC (see Analog to digital converter)

AEC (see Echo cancellation)

Air discharge (see ESD)

Akustica (p 262, 275)

Aliasing (p 455, 465)

Aliasing (digital) (p 157, 160, 261, 391, 402)

Ambient noise (p 36-38, 41-43, 123, 136, 143-146, 150-151, 205, 288-289, 307-310, 355-357, 346-347)

Amplitude distortion (p 155, 157)

Analog interface (p 365-376)

Analog microphone (p 365-381)

Analog to digital conversion (see Analog to digital converter)

Analog to digital conversion distortion (p 157)

Analog to digital converter (p 86, 118, 261, 389, 392, 394)

ANC (see Active noise cancellation)

Anechoic chamber (p 36, 147, 193, 203-204, 224, 573)

Anechoic room (see Anechoic chamber)

Antenna (p 138, 174, 179, 212-214, 245, 354, 416-420, 425, 429)

Anti-aliasing filter (p 261, 391)

Anti-stiction bump (p 257, 504)

AOP (see Acoustic overload point)

Array (see Microphone array)

Articulation index (p 144)

ASIC (p 100, 134, 137, 148, 170, 176, 177, 180-185, 205, 229-242, 248-249, 251-255, 260-275, 430-431, 434, 491-493, 503-505, 507-509, 516, 521-522, 525-526, 533-534, 561, 566, 570-571)

Assembly (device) (p 301, 334, 337-338, 346, 361-362, 495, 497, 502, 515-516, 537-538, 541)

Assembly (microphone) (p 249, 268-271, 273, 492, 526)

Assert (see Data assertion)

Attenuation (see Sound pressure attenuation)

Audio analyzer (p 199, 204, 208, 219-221, 225, 573)

Audio band (p 21-22, 26-34, 318, 386-387, 391, 402-403)

Audio breakthrough test (p 215)

Audio frequencies (see Audio band)

Audio zoom (p 442)

Autocorrelation (p 205, 573)

Axial frequency response (p 199)

Back volume (p 64, 69, 72-73, 100, 159, 170, 229, 233-237, 244, 250, 254, 265, 274-275, 323, 348, 438, 440, 522, 526, 528, 535)

Back-plate (p 61, 64-65, 70-74, 159, 247-259, 262-269, 284, 323, 503-504, 508, 513-514, 525-531, 574)

Back-plate perforations (Perforations) (p 64, 71-74, 250, 253-255, 258, 265, 267, 269, 323, 513, 527, 530)

Bandwidth of sound (digital signal) (p 387, 402-403, 412)

Barge-in (p 127-131, 164, 166, 310, 330, 340-341)

Bass frequencies (p 26-29)

Bending test (use case test) (see Deformation test)

Bi-directional microphone (figure-8 microphone) (p 62, 352, 439, 442, 446-456, 461)

Bias voltage (Biasing) (p 61, 71, 92, 100, 160, 250-258, 262, 269, 280, 284, 503-504, 544, 560)

Binaural recording (p 352)

Bit depth (p 411)

Blumlein (stereo pair) (p 352)

Bond wire (p 178, 185, 239-242, 262-263, 270, 275, 505, 573)

Bottom port (microphone) (p 184, 188, 194, 198, 231-232, 234-239, 242-243, 245, 271, 274, 302, 305, 315, 324, 335, 345-348, 362, 539, 541, 547-548, 551)

Broadside array (p 121, 351, 464-467)

Bulk (silicon) (p 68-69, 249, 251-252, 513, 527, 533, 555)

Calculations (decibel, sensitivity, input SPL, output voltage, noise) (p 577-586)

Calibration (p 220, 226, 565)

Capacitance (filtering) (p 424, 431-432)

Capacitance (of a signal line or load) (p 210-211, 385, 393, 401, 410)

Capacitance (of a sound sensor) (p 59-60, 64, 70, 74, 159, 247, 249-257, 262-267, 270)

Capacitor / capacitive microphone (see Condenser microphone)

Capillary attraction (p 529)

Cardioid (microphone) (Unidirectional) (p 439, 442, 452-458, 461-462)

Cavity (in acoustic channel) (p 53-55, 66, 104, 318-319, 325-326, 331, 334)

CDMA (p 420)

Change of static pressure test (use case test) (see pressure test)

Charged Device Model (CDM) (see ESD tests)

Choosing microphone for an application (p 304-312)

Clean room (p 526)

Cleaning (in production) (p 495, 537, 541-542, 549)

Cleanliness (p 492, 526, 536, 540-541)

Clipping (p 88, 155, 157-158, 380)

Clock (clock frequency) (clock signal) (digital microphone) (p 173, 242, 262, 383, 385-396, 398, 400-408, 412-414, 416, 418-419, 425, 430, 458)

Clock detection (p 262)

Clock fall time (p 405)

Clock frequency (see Clock)

Clock rise time (p 405)

Close-miking (p 97)

Coating (chip protection) (p 270, 493, 503-506, 522-523, 529-531)

Codec (p 89, 140, 377, 379-380, 384, 390, 394, 397, 411, 421, 431, 501)

Comb filtering (p 31, 47, 119-122, 353, 466)

Combination microphone (p 452-458, 461, 478)

Communication (between people) (p 23, 25, 27, 32, 44, 56-57, 127-128, 141-146, 187, 217, 295-296, 298, 307-310, 330, 340, 391, 436, 484)

Compliance (p 53, 67-68, 71, 74, 100, 110, 250-253, 256-257, 278, 281, 284, 320, 332-333, 344, 362, 440, 493, 503, 512, 518, 535)

Compression (air pressure) (p 45)

Compression (mechanical) (p 337)

Compression (signal) (p 109-110, 155-157, 283)

Condensation (p 508, 511, 523, 529, 569-570)

Condenser microphone (capacitor / capacitive microphone, electrostatic microphone) (p 56, 60-61, 63-74, 95, 158-160, 167, 185, 247-259, 260-264, 277, 283, 321, 440, 448, 513, 527-529, 544)

Conducted disturbance (p 174, 179, 378, 415, 419)

Conducted testing (RF) (p 214)

Conductive floor (p 543)

Constant load test (use case test) (p 572)

Contact (see Solder connection)

Contact discharge (ESD) (p 542, 564)

Contact pad (pin) (p 238-244, 269, 295, 335, 346, 390, 427, 432, 543, 547-550, 564)

Contamination (p 73, 77, 190, 229-230, 236, 253, 257, 259, 270, 300, 304, 311, 320, 360-363, 440, 480, 483, 490, 493, 495, 502, 503-505, 510-515, 518, 522, 524-532, 538, 540-541, 545, 553, 562-563, 573)

Contamination ingress (p 360, 524-525, 527-528, 530-531, 562)

Contamination test (p 515, 553, 562-563)

Context awareness (p 23, 308-309)

Coplanarity (mechanical) (p 244)

Cost (p 56, 93, 170, 176, 179, 241, 259, 263, 271-274, 277, 280, 288-289, 21-293, 297, 300-301, 306, 312, 373-374, 384, 389-390, 394, 397, 429-430, 474, 496-498, 524, 533, 536-537, 576)

Counter-plate (back-plate) (p 65, 258, 528)

Cpk (p 94)

Crest factor (p 38, 166, 578-579)

Crossover frequency (p 31)

Crosstalk (p 24, 240-241, 374, 422, 426)

Current consumption (Power consumption) (p 40, 81, 144, 169-173, 176, 205, 209-210, 218, 251, 253, 259-260, 280, 295, 306, 311-312, 385, 389-390, 393, 395-397, 397, 413, 567)

Current consumption measurement (p 209-210)

Data assertion (p 388, 404, 406-408, 412-413)

Data Output Load Capacitance (see Load capacitance)

dBFS (definition) (p 88-89)

DC safety check (p 567)

Dead cat (wind screen) (p 481-482)

Decibel (definition) (p 577)

Decibel ratios (p 584)

Decimation (Decimator) (p 261, 274, 379, 386, 390-392, 394-395, 402)

Deflection (p 68-70, 158-159, 256, 573)

Deformation test (use case tests) (p 572)

Delay time for data driven (see Timing)

Delay time for data high-Z (see Timing)

Delay time for data valid (see Timing)

Demodulation (Demodulated) (p 181, 212, 214, 215, 420, 430)

Deposition (p 247, 269-270)

Diaphragm (see Membrane)

Differential interface (p 170, 242, 244, 257, 306, 368-376, 380-381, 422)

Diffraction (p 50-51, 106, 124, 132, 193, 322, 340, 469)

Diffuse field frequency response (p 200)

Diffuse field sensitivity (p 200)

Digital interface (p 160, 172-173, 181, 211, 242, 261, 306, 365-366, 382-414, 418, 425)

Digital microphone (p 78, 82, 86-88, 118, 139, 157, 160, 172-173, 175, 181, 193, 210-211, 262, 305-306, 311, 365-366, 377, 382-386, 397-401, 416, 418, 422, 430, 567)

Digital signal path (p 410-412)

Digital signal processing (see DSP)

Direct injection test (p 214)

Directional microphone (p 41, 49, 70, 72, 75, 79, 88, 97-98, 106, 115, 136, 151, 199-200, 281, 286, 309, 321, 344, 351-352, 368, 436-473, 475, 477-478, 482, 487-489, 535)

Directional microphone array (see Microphone array)

Directivity / Directionality (p 41, 49, 53, 58, 62, 73, 75, 79, 88, 96-98, 106, 128, 189, 195-196, 281, 283, 286-287, 289-290, 321, 350-352, 436-473, 482, 487)

Directivity measurement (p 53, 195-196)

Directivity pattern (Polar plot / polar pattern) (p 62, 79, 96-97, 106, 195-196, 200, 283, 285, 289-290, 352, 439, 442, 445-446, 452-453, 455, 462, 465-467, 469, 472)

Distortion (p 21, 28, 33-34, 39, 43-44, 52, 58, 76, 79-81, 90, 101, 109, 111-112, 113, 116-117, 123-124, 126-128, 143, 146, 153-168, 186, 188, 207-209, 219-220, 222-223, 233, 249, 253, 257, 259-261, 267, 278, 284, 298, 304, 307-310, 329, 340, 366, 379-381, 391, 393, 398, 496)

Distribution (see Sensitivity distribution)

Disturbance filtering (see filtering)

Disturbance source (p 139, 174, 179, 181, 306, 355, 365, 377-378, 384, 398, 402, 418, 424-425, 433, 501)

Doping (p 493, 521, 532)

Drop test fixture (p 554-556)

Drop test (mechanical shock test, impact test) (p 519, 553-556, 560-562, 575)

DSP (Digital signal processing, Signal processing) (p 57-58, 113, 117, 124, 134, 140, 144, 153, 156, 173, 187-188, 279-280, 298, 303, 308, 310, 314, 329, 351, 367, 381, 391, 394-395, 411, 421, 442, 469, 473, 488, 495, 501)

Dust mesh (see Protective mesh)

Dust test (p 562)

Duty cycle (p 404)

Dynamic microphone (electromagnetic [moving coil] microphone) (p 61, 167, 281)

Dynamic range (p 40, 44, 81, 89-90, 140, 144, 149-150, 153, 168-171, 173, 187, 209, 258-259, 281, 289, 306, 369, 371-372, 374-375, 379-381, 398, 410-412, 476, 487)

Dynamic range measurement (p 209)

Echo cancellation (acoustic echo cancellation, AEC) (p 125-131, 163-164, 188, 309-310, 340, 353, 389, 397)

ECM (see Electret condenser microphone)

EIN (see Equivalent input noise)

EIN measurement (see Equivalent input noise measurement)

Electret [condenser] microphone (ECM) (p 56, 61, 63, 65, 95, 277-280, 289, 321, 341, 344, 544)

Electric field (p 63, 245, 251, 254)

Electrical connections (p 180, 185, 193, 218, 230, 233, 239-242, 245, 247-248, 262, 269-270, 278, 384, 421, 424, 501, 503, 505, 508-509, 521-522, 529, 533)

Electrical delay (p 452-454, 457-458)

Electrical implementation – analog microphones (p 365-381)

Electrical implementation – digital microphones (p 382-414)

Electrical implementation – EMC, RF, ESD (p 415-435)

Electrical interface (p 271, 294, 295, 306, 365-376, 382-397)

Electrical node (p 240, 505, 514, 525, 531)

Electrical robustness (p 77, 139, 175-176, 178, 182, 295, 299, 312, 368, 383-384, 386, 417, 421, 433, 563)

Electroacoustic test signals (p 222-223)

Electroacoustic testing (p 17, 192-228, 553)

Electromagnetic compatibility (EMC) (p 381, 415-435)

Electromagnetic [moving coil] microphone (see Dynamic microphone)

Electrostatic discharge (see ESD)

Electrostatic microphone (see Condenser microphone)

EMC (see Electromagnetic compatibility)

Endfire array (p 351-352, 444-458, 462, 466, 471)

Envelope (p 20, 156)

Environmental chamber (Weather chamber) (p 559, 570)

Environmental factors (p 77-78, 227, 229-230, 236, 249, 270, 279, 300, 303-304, 494, 503, 507, 521-523, 559)

Environmental regulations (p 276)

Environmental robustness (reliability) (p 77, 82, 190-191, 227, 229-230, 236, 249, 253, 259, 279, 295, 300, 303-304, 311, 314, 490, 491, 493-495, 502-505, 507-510, 521-524)

Environmental tests (p 552-553, 559-562)

EQ (see equalization)

Equalization (EQ) (p 28, 58, 103-104, 110, 125, 199, 283, 394, 448-449, 456, 458-461, 471)

Equivalent input noise (EIN) (p 80-81, 134, 145, 148-151, 168-169, 206, 209, 226, 288, 583)

Equivalent input noise calculation (p 583)

Equivalent input noise (EIN) measurement (p 206)

ESD (immunity) (electrostatic discharge) (p 77, 82, 182-185, 230, 260, 262, 363, 414, 433-435, 483, 490, 493, 495, 504, 519, 534, 540, 542-543, 553, 563-565, 567-568, 575)

ESD protection (p 184, 414, 483, 495)

ESD tests (Charged Device Model (CDM)) (Human Body Model (HBM)) (Machine Model (MM)) (p 184-185, 563-565)

Etching (p 247, 268-270, 493)

External particles (p 511, 526-527)

Failure analysis (p 553, 572-573)

Fall-asleep time (p 393)

Far field (p 40, 52-53, 97, 193, 197)

Faraday Cage (p 180, 184, 230, 239, 242, 245-246, 399, 402, 416, 420, 427-429, 506)

Fast Fourier transform (see FFT)

Feedback loop (p 217, 438)

FEM (see Finite element modeling)

FFT (fast Fourier transform) (p 205, 208, 573)

Field failure (p 293, 497)

Figure-8 microphone (see Bi-directional microphone)

Filtering components (p 176, 180, 312, 400, 431-433)

Filtering (disturbances) (p 139, 176-180, 215, 262, 273, 312, 344, 354, 366, 370, 378, 380-381, 384, 398-402, 421, 423, 429-433, 501, 506)

Filtering (signal alteration) (p 28-29, 48, 104, 107, 118, 283, 391-392, 394, 480, 484-488)

Final testing (p 91, 271, 500, 539)

Finite Element Modeling (p 574)

Flexible circuit board (p 301, 341, 419, 423, 435, 492, 538, 545)

Flip chip connection (p 233, 239-241, 262-263, 268, 270-271, 275, 509, 516, 534)

Flow resistance (p 254, 320)

Foam (p 52, 105, 314, 316, 320, 331-332, 341, 481-484, 489)

FR (see Frequency response)

Free field frequency response (p 196-200)

Frequency band (audio) (p 26-33, 70, 101-102, 108, 115, 118, 143, 149, 173, 205, 208, 222, 234, 308-309, 318, 324, 363, 366, 380, 386, 389, 403, 455, 484, 487)

Frequency response (FR) (p 28, 33, 51, 54-55, 66-67, 70, 72, 76, 80, 99-108, 111, 114-118, 120, 124, 127, 133, 137, 143, 149, 155, 182, 186-187, 190, 194, 196-200, 216, 218-220, 222, 233-237, 239, 249-250, 252, 257, 259-260, 270, 279, 281-284, 290, 295, 298, 304, 307-310, 313-314, 316-326, 329, 331, 334, 339, 348, 349-350, 362-363, 366-368, 434, 437, 441, 445-456, 458-461, 465-472, 480, 496, 504-505, 513-514, 529, 531)

Frequency response distortion (p 101, 127, 155)

Frequency response measurement (p 196-200)

Fringing electrical fields (p 254, 267)

Front volume (front cavity) (p 64-67, 100, 108, 233-237, 254, 264, 314-315, 319, 323-324, 326)

Full-duplex (communication) (p 127, 330)

Fumes (p 494, 511, 529, 562)

Gap (see Membrane – back-plate gap)

Glob top (p 185, 230, 236, 270, 504, 506, 522)

Ground layer (see Ground plane)

Ground plane (ground layer) (p 241, 245-246, 402, 423-424, 426-427, 428-429)

Ground ring (p 184, 236, 238-239, 242, 427-428)

Grounding (p 177, 180, 184, 226, 230, 238, 246, 370, 377, 381, 383-384, 399, 416, 421-424, 429, 435, 501, 506, 543)

Group delay (p 80, 116, 124, 204, 457-458)

Group delay measurement (p 204)

Guided drop test (p 555-556)

Half-duplex (communication) (p 127, 330)

Handling noise (p 329, 342-344, 350, 354, 440)

Handling (treatment) (p 77, 134, 185, 190, 249, 304, 327-329, 333, 342-344, 350, 353-354, 440, 492, 495, 497, 505, 515-516, 532-533, 536-538, 543, 571)

Harmonic distortion (p 28, 33, 81, 127, 133, 154-155, 161-165, 207-209)

Harmonic distortion measurement (p 207-209)

Harmonic frequencies (p 21, 28, 30, 154, 161, 207)

HATS (see Head and Torso Simulator)

HBM (see Human body model)

Head and Torso Simulator (p 216-217, 220, 352, 475)

Head Related Transfer Function (HRTF) (p 352)

Heat shield (p 551)

Heat sources (p 349, 54-355, 551)

Helmholtz resonance (p 53-55, 66-67, 104, 108, 234)

Hi-Z state (see High-impedance state)

High frequencies (p 20, 30-31, 45, 50, 61-62, 67, 108, 118, 123-124, 131-132, 200, 202, 252, 281-283, 286-287, 363, 387, 459, 467, 470, 479, 483)

High midrange frequencies (p 29)

High pass filtering (p 104, 380, 480, 484, 487)

High temperature operation (env test) (p 560)

High temperature storage (env test) (p 559)

High-impedance state (Hi-Z state) (p 393, 407, 412, 414)

Hot air nozzle (p 549-551)

Housing (of device or microphone) (p 49, 63-64, 88, 97-98, 104-105, 138, 180, 234, 287-289, 314-315, 321, 343, 350, 360, 442, 451, 469-470, 476, 510)

HRTF (see Head Related Transfer Function)

Human Body Model (HBM) (ESD) (see ESD tests)

Humidity endurance (env test) (p 560)

Humidity (reliability) (p 77, 187, 227, 257, 279, 304, 490, 502, 503-505, 507-508, 521-524, 540, 546, 559-561, 570, 575)

Humidity test (p 570-571)

Hypercardioid (p 453)

Hysteresis (p 408-410)

I2S (interface) (inter-IC sound) (p 242, 261, 274, 306, 386, 390, 392, 394-396)

I2C interface (p 395)

Impact test (see Drop test)

Impedance (acoustical) (p 46, 314, 479)

Impedance (electrical) (p 46, 185, 211, 240, 245, 253, 260, 372, 380, 383, 393, 401, 407, 412, 414, 423-424, 426, 431-433, 435, 501, 505-506, 508, 514, 522, 531, 566-567)

Implementation (of microphones into devices and systems) (p 297-435)

Inductance (p 265, 424, 432)

Industrial design (p 297, 313, 318, 325, 349, 356, 360, 446, 467, 469)

Infrared rework station (p 550-551)

Infrasound, infrasonic (p 24, 70, 164, 476, 487)

Input logic high level (IO voltage) (p 408)

Input logic low level (IO voltage) (p 408)

Input sound pressure level (p 81, 86, 89-90, 161, 169, 371, 374-375, 580, 582-583, 585-586)

Intelligibility (p 29-30, 32, 42, 48, 56-57, 141, 143-146, 163, 187, 298, 437, 475, 487)

Intensity (p 46, 50, 52, 119, 197, 442, 462-463, 476)

Inter-IC sound (see I2S)

Interface (p 139, 160, 172-173, 181, 241-243, 261, 271, 274, 280, 294, 299, 305-306, 365-414, 418-419, 422, 424-425, 583)

Internal particles (contamination) (p 525-526)

InvenSense (see TDK-InvenSense)

Inverse square law (p 40, 131, 193, 459-463)

Inverse square sensitivity component (p 459-463)

Inverting (p 78, 95, 123, 199, 457)

IO voltage (p 393, 408-410)

Ionized airflow (ESD) (p 543)

IP rating (contamination immunity) (p 363, 563)

Jig (p 203, 213-214, 228, 553-556)

Jitter (p 393)

jitter distortion (see Jitter)

Joint (see Solder connection)

Key Performance Indicator (KPI) (p 76-77, 196, 576)

Key Value Indicator (KVI) (p 76-84, 85-191)

Knowles (Electronics, LLC) (p 63, 232, 235, 243, 247-248, 252, 256)

KPI (see Key performance indicator)

KVI (see Key value indicator)

L/R selection (see Left/right selection)

Laminate package (p 232, 237-238, 241-242, 245-246, 268, 270-271, 274, 324, 508)

Laser (p 62-63, 185, 248, 264, 270-271, 360, 548, 573)

Latch-up (p 566)

Latch-up test (see Latch-up)

Latency (p 111-112, 115, 124, 260, 310, 381, 389, 395-397, 458)

Lavalier microphone (p 41, 136)

Layout (p 175, 178, 181, 242-243, 335, 365, 370, 372-373, 377, 381, 384, 398-400, 421, 424-425, 432-433, 532, 535, 547)

Left/right selection (L/R selection) (p 242, 261, 388, 394, 401, 412-413, 418)

LFRO (see Low frequency roll-off frequency)

Lid (of a microphone package) (p 63, 184, 230, 232-233, 235-238, 240-241, 243-246, 248, 263, 268, 270-271, 273-274, 276, 336, 505, 508-509, 534, 539, 564, 570)

Light sensitivity (p 185-186, 215)

Light sensitivity test (use case test) (see Light sensitivity)

Linear array (p 469)

Liquid cleaning (see Wet cleaning)

Liquid contamination (p 363, 512, 529-531, 563)

Liquid test (contamination test) (p 562-563)

Load capacitance (p 211, 393, 410)

Loudspeaker (p 23, 25-26, 29, 31, 39, 42, 47-48, 53, 55, 57-58, 61, 73, 103, 120-121, 123, 125-131, 133-134, 137, 140, 142-143, 163-164, 166-167, 193-195, 197-203, 217, 219-223, 309-310, 323, 329-330, 340-341, 344, 352-353, 356, 396-397, 438, 488)

Low frequency roll-off frequency (LFRO, Roll-off frequency, low-frequency roll off point) (-3dB frequency / point) (p 24, 26, 70, 99-100, 103, 114, 116, 118, 123, 189, 234, 249, 254, 310, 484)

Low midrange frequencies (p 29-30)

Low power mode (p 81, 205, 262, 295, 311-312, 389, 397)

Low temperature operation (env test) (p 560)

Low Temperature Storage (env test) (p 559, 575)

Machine Model (MM) (ESD test) (see ESD tests)

Manufacturing / Production (device) (p 76, 82, 91, 117, 179, 182-183, 190-191, 224, 291-294, 299-301, 312, 329, 333-339, 362, 435, 483, 490-492, 495-502, 508-512, 515-516, 520, 524-525, 532, 534, 536-551, 564, 566, 575)

Manufacturing / Production (microphone) (p 65, 70, 91-94, 122, 182-183, 187-188, 190, 217-218, 224, 235, 240, 243, 247, 251, 256-257, 259, 268-274, 279, 381, 491-493, 496, 500-501, 503-504, 508-512, 515-516, 523-526, 528, 530, 532-533, 566, 572, 574, 576)

Manufacturing facilities (Production facilities) (p 213, 301, 492, 495, 524, 526, 536, 540-541, 543)

Manufacturing yield (see Yield)

Mask (semiconductor manufacturing) (p 269)

Masking (acoustical) (p 102, 134, 145, 162)

Matching (p 82, 91-92, 95, 107, 111, 117, 122, 187-189, 192, 259, 295, 303, 309-310, 340)

Maximum ratings (p 567-568)

Maximum signal level (p 39, 89, 154, 158, 160, 169-171, 261, 371, 374, 379, 386, 410-411, 582)

Mechanical abuse (p 78, 82, 190, 229, 300, 314, 328, 494, 503, 515-518, 535, 538, 553)

Mechanical implementation (p 26, 105, 137, 139, 231, 297, 301, 315, 327-364, 493, 501, 518, 534)

Mechanical pressure (p 490, 501, 516, 518, 537, 569)

Mechanical robustness (p 77, 82, 184, 256, 493, 518, 533, 535, 552)

Mechanical shock test (see Drop test)

Mechanical stress (p 238, 328, 349, 359-360, 505, 510, 516, 537, 574, 575)

Mechanical vibrations (see Structure-borne vibrations)

Membrane – back-plate gap (gap, sense gap) (p 61, 70-72, 73-74, 250-251, 254-259, 264, 267-269, 284, 513-514, 525, 527-528, 530-531)

Membrane (Diaphragm) (p 59, 61-62, 64-75, 100, 134, 137, 158-159, 167, 185-186, 202, 233, 236, 247-259, 262, 264-269, 277-287, 315, 320, 323, 343-344, 438, 440, 444, 448, 459, 471, 478, 503, 508, 513-514, 525-526, 527-531, 532, 544, 555-556)

Membrane (protection) (p 361-363, 494, 525, 531-532, 540)

MEMS microphone (p 229-276, 277-290)

MEMS (sensor) (see Acoustic MEMS sensor)

Mesh (see Protective element)

Microphone (p 56-75)

Microphone array (Array) (Directional microphone array) (p 97, 199, 309, 442-473)

Microphone placement (p 58, 328, 349-360, 499)

Microphone protection (reliability) (p 63, 105, 229-230, 236, 283, 300, 327, 360-364, 483, 494, 499, 502, 504, 521, 522, 523, 525, 530, 531-534, 541, 545, 563)

Midrange frequencies (p 29)

MIPI (Mobile Industry Processor Interface) (p 395-396)

Mobile Industry Processor Interface (see MIPI)

Modeling (or MEMS microphones) (p 265-267, 324, 574)

Moisture (reliability) (p 77, 480, 482, 494, 503, 505, 508, 510-513, 521-522, 529-530, 540, 546, 560, 562, 575)

Moisture sensitivity level (MSL) (p 510, 546, 560, 562)

Monolithic MEMS (see Single-chip MEMS microphone)

Moving coil microphone (see Dynamic microphone)

MSL (see Moisture sensitivity level)

Multi-sourcing (p 90, 294, 499)

Multichannel (capturing) (p 133, 189, 353, 359, 368, 486)

Near field (p 52, 97)

Near-field radiation test (p 214)

Noise (p 134-152)

Noise cancellation (p 115, 117, 123-124, 143, 145, 151, 157, 163-164, 188-189, 225, 290, 298, 308-311, 351, 356-357, 367-368, 381, 389, 395-397, 485, 501)

Noise level (p 33, 36-38, 40-42, 44, 61, 73, 80, 89, 130, 136-138, 140-141, 144-146, 147-152, 168-169, 200, 206, 209, 219, 224, 225-227, 241, 288-289, 307-310, 320, 366, 379, 386, 398, 422, 434, 437, 471, 476, 486-487, 500, 505, 514, 570, 573, 578, 583)

Noise measurement (see Self-noise measurement)

Noise shaping (p 386)

Noise source (p 73, 122, 134, 136-138, 140-141, 145, 147, 150-151, 179, 223, 226, 288, 343-344, 349, 353-356, 379, 399, 410, 421, 425-426, 578)

Non-inverting (p 78, 95)

Nonlinear array (p 469)

Normal mode (use mode) (p 81, 205, 389, 393, 397)

Normal mode (vibration) (p 343)

Normal-scale microphone (p 60, 62, 277, 281-284, 287-289)

Nozzle (hot air, rework) (p 549-551)

Nozzle (pick & place) (p 538-539)

Null (frequency) (p 447, 454-455, 465-466)

Nyquist frequency / theorem (p 387, 402, 412)

Off-axis direction (p 96, 200, 284-286, 445, 450-451, 465)

Off-axis frequency response (p 290)

Omnidirectional (p 41, 72, 79, 87-88, 97-98, 196, 281, 286-287, 321, 351-352, 436, 438-444, 452, 456, 462, 471-473, 475-478, 487)

On-axis direction (p 88, 96-97, 200, 284, 445, 453, 468)

On-axis frequency response (p 106, 290, 453, 455-456)

On-axis sensitivity (p 200, 468)

Operating mode (Use mode) (p 81, 173, 205, 209, 262, 311-312, 356, 388-389, 393)

Orientation marking (p 243, 551)

Oscillator (in microphone ASIC) (p 262)

Output load capacitance (p 211, 393, 410)

Output logic high level (IO voltage) (p 409-410)

Output logic low level (IO voltage) (p 409-410)

Output voltage (p 86, 155, 248, 250, 264, 365, 371, 374-376, 409-410, 579-583, 585-586)

Oversampling (ratio) (p 386, 391, 402-403)

PA (see Public address)

Package (of a microphone) (p 63-64, 65, 72, 100, 117, 137-138, 148, 178, 180, 182, 184-186, 195, 202, 218, 221, 229-233, 235-246, 249-250, 254, 263, 268, 270-276, 285, 299, 302, 305, 314-320, 322-324, 326, 328, 330, 332, 336, 345, 347, 359, 361-364, 390-391, 397, 399, 427-428, 435-436, 438, 440-441, 467, 484, 491-492, 500, 503-510, 512, 514-518, 521-528, 531-540, 545-547, 549, 574)

Package (microphone transportation) (see Transportation packaging / package)

Parasitic capacitances (‘parasitics’) (p 252-253, 256, 263, 267)

Particle (contamination) (see Solid contamination)

Particle velocity (p 19, 52, 59, 197, 479)

PCM (Pulse code modulation) (interface) (p 261, 386, 390-392, 394-396, 411-412, 458)

PDM (pulse density modulation) (interface) (p 242, 244, 260-261, 306, 386-396, 400, 402-403, 411-414, 458)

Perforations (see Back-plate perforations)

PG (see Pressure gradient (microphone))

Phase distortion (p 33, 51, 79-80, 111-112, 114, 116-117, 126, 133, 155, 188, 233, 298, 304, 308-310, 329, 366, 381, 398)

Phase response (p 79-80, 103, 112-118, 124, 126, 187, 201, 204, 219, 222)

Phase response measurement (p 201-204)

Phase shift (p 79, 103, 110-115, 119, 123, 155, 189, 201-204, 310, 444)

Phase shift measurement (p 201-204)

Pi filter (p 433)

Pick & place (p 270, 335, 515, 534, 538-539, 547)

Pick-up area (pick & place) (p 539)

Piezoelectric microphone (sound sensor) (p 59, 62, 159, 248-249, 259-260, 262, 264, 267, 269, 280, 513, 528, 532)

Pitch (of back-plate holes) (p 71, 74, 250, 254-256)

Pitch (quality of sound) (p 20-21, 27, 42)

Placement (of microphone in device) (p 58, 137, 275, 300, 319, 328, 349-360, 377, 381, 398, 399, 417, 421, 424-426, 441, 484, 499)

Plosives (p 441, 472, 474, 489)

Polar plot (see Directivity pattern)

Polarity (of a microphone) (p 78, 95-96, 125, 194-195)

Polarity measurement (p 194-195)

Pop filter (p 283, 489)

Power consumption (see Current consumption)

Power supply disturbances (p 175, 177, 181, 504)

Power supply rejection (ratio) (PSR / PSRR) (p 82, 138-139, 174-177, 179, 181, 210-211, 241, 275, 421, 431)

Power supply rejection (ratio) (PSR / PSRR) measurement (p 210-211)

Pressure gradient (microphone) (p 75, 438-441, 446, 452, 455-456, 458-461, 471, 475-478, 535)

Pressure gradient sensitivity (component) (p 459-462)

Pressure microphone (p 75, 438, 440-441, 456, 458, 461, 471, 477, 535)

Pressure shock (pulse) (p 77, 183, 251, 304, 311, 434-435, 483, 490, 503, 514, 517, 519-520, 527, 533, 535, 539, 541-542, 553-554, 557, 565, 570, 574)

Pressure shock test (reliability test) (p 557)

Pressure shock test (use case test) (p 570)

Pressure test (acoustic sound pressure) (p 557)

Pressure test (Change of static pressure test) (use case test) (p 570)

Pressure vent hole (Vent hole, vent opening) (p 69-70, 72, 100, 234, 250, 254, 265, 513, 527, 530)

Pressurized air (p 495, 520, 541)

Price (p 93, 191, 270, 271-273, 280-281, 288, 291-292, 294-295, 300-301, 305, 312, 346, 385, 395, 471, 473, 496)

Production (see Manufacturing)

Production facilities (see Manufacturing facilities)

Production testing (device) (p 495, 500)

Production testing (microphone) (p 217-218, 268, 492)

Production yield (see Yield)

Propagation (of electrical and electromagnetic disturbances) (p 177, 179, 181, 423)

Propagation (of heat) (p 545)

Propagation (of sound) (p 42-52, 106, 119, 123-124, 126-130, 134, 143, 145, 202, 319, 340-341, 444)

Protection (see Microphone protection)

Protective element (protective membrane / protective mesh / dust mesh / mesh) (p 52, 105, 137, 186, 314, 320, 360-363, 435, 494, 525, 531-532, 540)

Protective membrane (see Protective element)

Protective mesh (dust mesh / mesh) (see Protective element)

Protective tape (Tape) (manufacturing) (p 545)

Proximity effect (p 40, 97, 289, 441, 458-462, 478)

PSR (see Power supply rejection)

PSR measurement (see Power supply rejection measurement)

PSRR (see Power supply rejection ratio)

PSRR measurement (see Power supply rejection ratio measurement)

Public address (PA) (p 121, 163, 166, 277, 290, 438)

Pull-in (force) (p 251-253, 257-258, 266-267, 503-504)

Pulse code modulation (see PCM)

Pulse density modulation (see PDM)

Quality (p 576)

Radiated disturbance (p 179-180, 212, 368, 419-420, 425, 427)

Radiated testing (RF) (p 212, 214)

Reactive sound field (p 197)

Reference microphone (p 194-195, 198, 201-204, 220-221, 223)

Reflection(s) (acoustical) (p 46-49, 51, 97, 106, 120, 123-124, 131-132, 136, 193-194, 198-200, 203-204, 221, 283, 285, 322, 340, 437, 469, 482, 573)

Reflow (Soldering) (p 95, 230, 238, 240, 268, 271, 276, 280, 335-336, 362, 492, 495, 505, 508-510, 515, 534, 537, 540, 542-551, 562, 565-566)

Reflow profile (p 543-545, 551)

Reflow test (p 565-566)

Refraction (p 51)

Reliability (p 69, 74-77, 82, 90, 186, 190-191, 233, 237-238, 244, 250, 253, 257, 259, 271-274, 291-295, 297, 299-301, 303-304, 311-312, 314, 328, 332, 334-335, 339, 345, 349-350, 360, 367, 382-383, 440, 490-551)

Reliability hazards (p 507-520)

Reliability improvement (p 521-535)

Reliability in device production (p 536-551)

Reliability simulation (p 574)

Reliability testing (p 552-572)

Resistance (acoustic) (p 72-74, 105, 115, 134, 137, 254-255, 320-321, 362-363, 435, 446, 483)

Resistance (electrical) (p 70, 185, 245, 253, 257, 265, 401, 422, 424, 432, 508, 514, 522)

Resonance (microphone transducer) (p 24, 31, 53-55, 66-67, 72, 100, 102-105, 108, 110, 115-116, 118, 124, 234, 239, 249, 252-253, 257, 267, 278, 281-283, 314, 318-320, 322-324, 334, 341, 363, 470, 480, 529, 573)

Response window (specification / requirement) (p 99, 216)

Reverb (effect) (p 48, 58)

Reverberation (reverberant) (p 36, 46, 48-49, 143, 198, 200, 224, 437, 451, 472)

Reverberation time (RT₆₀) (p 48, 143)

Reworking (p 495-496, 498, 508-510, 515, 534, 549-551)

RF immunity (p 82, 138-139, 178-182, 211-215, 241, 245-246, 260, 275, 295, 374, 415-434)

RF immunity testing (p 211-213)

RF testing (p 211-215)

Ribbon microphone (p 62)

Rigidity (rigid) (p 230, 249, 255, 269, 302, 333, 338, 341, 343, 359, 361, 364, 533)

Risk mitigation (p 293-294, 499)

RoHS (p 276)

Roll-off frequency (see Low frequency roll-off frequency)

Routing (sawing) (of a circuit board) (p 541)

Sampling (digital interfaces) (p 386-388, 391-392, 402-403, 412, 457-458)

Sampling (testing) (p 493, 576)

Sawing (of a circuit board) (see Routing)

Schematic (p 266, 370, 377, 421)

Scrapping (p 93, 496, 498)

Screw boss (screw tower) (p 333, 336, 343)

Sealing (see Acoustic sealing)

Sealing element (acoustic) (Sealing gasket) (p 229, 315-317, 325-326, 330-339, 347, 349, 361, 483, 518, 533-534)

Sealing gasket (see Sealing element)

Sealing ring (p 238-239, 242, 316, 335, 547-548, 551)

Semiconductor (p 65, 182-183, 185, 229-230, 233, 240, 245, 247, 260, 262-263, 268-269, 272, 279, 434, 492-493, 505, 507-511, 516, 521-522, 525-526, 529, 532, 546, 564, 566, 573)

Send frequency response test (p 216)

Send loudness rating test (p 216-217)

Self-noise (p 37, 41-42, 58, 61, 66, 69, 72-74, 80-81, 85, 89, 127, 134, 137-139, 143, 145, 147-152, 168-171, 173-174, 187-188, 205-207, 209, 219-220, 223, 225-226, 229, 249, 254-255, 259-260, 284, 288-289, 307, 309-310, 320, 368, 379, 410, 411, 449-451, 466, 496, 504-505, 553, 578)

Self-noise measurement (Noise measurement) (p 205-207)

Sense gap (see Membrane – back-plate gap)

SenseWire (p 396)

sensiBel (p 248-249)

Sensitivity (p 21-22, 26, 33, 49, 53, 58, 61, 67, 70, 72, 74, 77-80, 85-100, 106-107, 122, 130, 133, 138, 140, 143, 148, 151-152, 159, 169-171, 182, 186-190, 192-194, 195-198, 200, 206, 217-218, 220, 222, 227, 233-234, 239, 249-253, 255-256, 259-260, 266-267, 270-271, 278-281, 284-286, 290, 303, 309-310, 316, 321, 324, 329, 339, 344, 352, 362-363, 365, 368, 371-372, 374-376, 379-381, 397, 434, 436, 439-442, 445-446, 448-453, 455, 459-462, 468, 478-479, 483, 496, 500, 504-505, 510, 513-514, 528, 531, 535, 553, 560, 569-570, 576, 579-583, 585-586)

Sensitivity distribution (p 92-94)

Sensitivity matching (p 91-92, 187-188, 192)

Sensitivity measurement (p 192-194)

Sensitivity standardization (see Standardization)

Sensitivity tolerance (p 92-94, 188, 293, 295, 381, 398, 493)

Series resistor (p 400, 432)

Shielding (disturbances) (p 178, 213, 230, 366, 377, 381, 398-399, 402, 416, 421, 427-429, 501)

Short circuit (current) (p 211, 393, 566)

Sibilance (p 30, 102, 489)

Sidetone (test) (p 216-217)

Sigma-delta conversion (Sigma-delta converter) (p 261, 389, 392)

Signal filtering (disturbances) (p 139, 175-176, 177-180, 215, 262, 273, 312, 354, 366, 370, 377-378, 380-381, 384, 398-402, 421, 423, 429-433, 501, 506)

Signal processing (see DSP)

Signal termination (p 400-401)

Signal to noise ratio (digital) (p 411)

Signal to noise ratio (SNR) (p 42, 51, 72, 76, 80-81, 134, 135-136, 146, 152, 169, 206-207, 222-223, 267, 278, 281, 298, 329, 366, 380, 385, 441, 451, 466, 468, 470)

Signal to noise ratio measurement (SNR measurement) (p 206-207)

Simulations (p 98, 212, 265-267, 324-326, 446, 468-469, 533, 535, 552, 574)

Single-chip MEMS microphone (monolithic MEMS) (p 262-263, 275)

Single-ended interface (p 242, 244, 306, 368-374, 375, 380-381, 419, 422, 424)

Size (of device / housing) (p 51, 97-98, 105, 132, 171, 277, 279, 288-289, 321-322, 333, 345, 349-351, 354, 444, 446, 467, 469, 473-474, 483, 499)

Size (of microphone) (p 56-58, 63, 90, 97, 170, 230, 241-244, 271, 273-275, 277-279, 287-288, 294-295, 305, 339, 390, 395, 533, 539)

Size (of microphone implementation) (p 297, 302, 305, 345-348, 472-473)

Sleep mode (Standby mode) (p 262, 389, 392-393, 397, 413-414)

SLIMbus (p 395-396)

SLR (see Send loudness rating) (p 216-217)

SNR (see Signal to noise ratio)

SNR measurement (see Signal to noise ratio measurement)

Solder bridging (p 335, 346, 547, 549)

Solder connection (solder contact / solder joint) (p 238, 244, 270-271, 276, 332, 345, 347, 360, 364, 428, 501, 504, 506, 509-510, 515-517, 533-534, 537, 543, 545, 549-551)

Solder paste (p 238, 335, 509, 543-544, 547-551)

Soldering (see Reflow)

Solid contamination (Particles) (p 360, 362-363, 511, 513-515, 518, 524-531, 541, 545, 548, 553, 562-563)

Sonogram (p 205, 573)

Sound (p 19-55)

Sound channel (see Acoustic channel)

Sound port (on microphone package) (p 64-67, 69, 75, 96, 100, 107-108, 137, 148, 182, 184-185, 193, 195, 201-202, 221, 229-238, 242-244, 263-264, 285, 295, 314-316, 318-319, 321, 323-324, 326, 328-329, 335, 337, 347, 360, 436, 438, 440, 510, 523-524, 527, 537, 539, 541, 545, 547, 551, 557, 564, 570)

Sound pressure attenuation (propagation) (p 40-43, 45, 47, 50, 105, 124, 129-131, 136, 322, 357, 459, 483)

Sound pressure level (SPL) (p 35-43)

Sound propagation (p 43-52)

Source localization (p 115, 117, 122-123, 131-132, 189, 368)

Source termination (resistors) (p 400-401)

SoundWire (p 261, 306, 395-396)

Speech (properties, considerations) (p 26-33, 41-42, 48, 51, 56, 102, 127-131, 136, 141-146, 163-164, 168-169, 216, 298, 307-309, 330, 357, 391, 436-437, 441, 472, 474-475, 484, 486-487, 489, 579)

Speech recognition (p 25, 42, 128, 134, 141, 143, 145-146, 163-164, 189, 298, 308-309, 312, 367-368, 437, 501)

Speech user interface (Speech UI) (p 164, 171, 281, 293, 296, 309, 311, 317, 330, 340, 359, 392, 397, 436, 443)

SPL (see Sound pressure level)

Springs (MEMS sensor) (p 68, 158, 250, 252, 254, 513-514, 527, 530-531, 533)

Squeegee (manufacturing) (p 547-548, 550)

Squeeze film damping (p 255)

Stability (of microphone performance) (p 76-77, 82, 186-190, 241, 280, 291, 295, 299, 303-304, 315-317, 328-329, 367, 383, 493, 495, 504-505, 533, 571)

Standardization (standardize) (p 24, 26, 85, 90, 109, 294-295, 305, 318, 346, 510, 542, 552, 563)

Standby mode (see Sleep mode)

Star grounding (p 423-424)

Stencil (p 547-548, 550)

Stereo (capturing) (p 133, 189, 351-352, 358-359, 486)

Stiction (p 257, 504, 529)

Stiffness (p 67, 72, 250-252, 257, 535)

Stress (mechanical) (p 238, 268, 328, 345, 349, 359-360, 364, 503, 505, 510, 514, 516, 533, 537, 554, 562, 574, 575)

Structure-borne noise (mechanical vibrations) (p 28, 45, 59, 62, 127-128, 134, 137, 223-225, 279, 328, 340-341, 343-344, 349, 353-354, 440, 476, 517)

Sub bass frequencies (p 26-29)

Substrate board (of microphone) (p 232-233, 235-237, 239-241, 245-246, 249, 263, 268, 270-271, 273-274, 276, 336, 431, 441, 505, 508-509, 516, 534, 549)

Substrate (of MEMS sensor) (p 249, 269)

Supercardioid (p 453, 472)

Supply risk (supply safety / problem / shortage) (component shortage) (p 90, 291-294, 346, 497, 499)

Supply voltage (p 94, 173-176, 189, 210, 228, 370, 373, 378, 383, 388, 394, 398-401, 405-406, 408, 413, 418, 431, 504, 567-568)

Surface mounted component (p 95, 230, 277-278, 280, 345-346, 508, 546, 550, 565)

Surface tension (p 529)

Suspension (method / type) (capacitive membrane) (p 68, 250-252)

Tape (see Protective tape)

Tape & reel (packaging) (p 271, 538-540)

TDK-InvenSense (p 236, 239, 244, 247, 257, 362, 466)

TDMA (p 139, 211, 214, 420)

TDMA test (p 214)

Telecommunication (see Communication)

Temperature and humidity test (use case test) (p 570-571)

Temperature gradient test (use case test) (p 571)

Temperature / Humidity Bias test (env test) (p 560)

Temperature profile (reflow) (p 510, 542-543)

Temperature (reliability & accuracy factor) (p 77, 94, 187-189, 227, 279, 304, 355, 367, 490, 503, 505, 507-510, 521, 523-524, 542, 543-545, 551, 559-561, 566, 568-571, 575)

Tension (acoustical factor) (p 68, 110, 250-252, 277-278, 281, 320, 440, 516)

Tension (reliability) (p 359, 516, 529)

Termination resistor (p 400-401)

Test signal (p 32, 152, 199, 206, 209, 211, 216, 219, 222-223)

Test systems (p 192-228)

THD (see Total harmonic distortion)

THD measurement (see Total harmonic distortion measurement)

THD+N (see Total harmonic distortion + noise)

THD+N measurement (see Total harmonic distortion + noise measurement)

Thermal cycle (env test) (p 560)

Thermal reworking tweezers (p 550)

Thermal shock (env test) (p 560)

Threshold of hearing (p 36, 144, 584)

Timbre (of sound) (p 21, 154)

Timing (digital microphone) (p 400-410)

Tolerance (mechanical / manufacturing / placement) (p 203, 243, 274, 316, 328, 332-338, 347, 539)

Tolerance chain (p 93, 335-337)

Tolerance (sensitivity) (see Sensitivity Tolerance)

Tomb stoning (p 549)

Top port (microphone) (p 184, 231-232, 235-238, 241-243, 270-271, 275, 285-286, 305, 315, 319, 324, 331-332, 336-338, 345, 347-348, 361, 429, 518, 533, 537-539, 548, 551)

Total harmonic distortion (+ noise) (THD(+N)) (p 81, 153, 161-167, 207-209, 222-223, 266-267, 295, 298, 307, 309-310)

Total harmonic distortion (+ noise) measurement (THD(+N) measurement) (p 207-208, 222-223)

Transient response (p 67, 69, 109-110, 281)

Transportation (p 271, 362, 435, 492, 516, 525, 532, 534, 538-540, 541, 546, 575)

Transportation packaging / package (test) (p 575)

Troubleshooting (p 179, 498, 500-506)

Tumble test (Unguided drop test) (p 556)

Turbulence, turbulent (p 440, 474-478, 481, 484-486, 488)

Twisting (test) (use case test) (p 516, 572)

Type approval test (p 216-217)

Ultrasonic (see Ultrasound)

Ultrasonic cleaning (p 542)

Ultrasonic welding (p 542)

Ultrasound (Ultrasonic) (p 22-24, 32-33, 48, 62, 68, 108, 199, 222, 278, 284, 322-324, 380, 387, 389, 397, 403, 412, 430, 542, 573)

Underfill (p 509, 516)

Unguided drop test (see Tumble test)

Unidirectional (microphone) (see Cardioid microphone)

Usage tests (see Use case tests)

Use in cold temperature test (use case test) (p 571)

Use in hot temperature test (use case test) (p 571)

Use case tests (Usage tests, Use tests) (p 568-572)

Use mode (see Operating mode)

Vacuum nozzle (see Pick & place)

Variable Frequency Vibration Test (see Vibration test)

Vent hole (see Pressure vent hole)

Vesper (p 248, 260)

Via (in a circuit board) (p 241, 245-246, 401, 423, 426, 428-429, 432, 435)

Vibration (reliability) (p 490, 503, 511, 516-517, 526, 532, 553, 558, 562, 575)

Vibration (test) (Variable Frequency Vibration Test) (p 553, 558, 575)

Video (p 57, 164, 187, 281, 307, 342, 358, 359, 436)

Wake-up (time) (p 392-393, 397)

Wavefront (p 50, 52)

Wavelength (p 20, 34, 46, 49-51, 53, 97-98, 120, 131-132, 197, 202-203, 285-287, 321-322, 447-448, 453-455, 465, 469-470)

Weather chamber (see Environmental chamber)

WER (see Word error rate)

Wet cleaning (of a circuit board) (Liquid cleaning) (p 495, 537, 541)

Wind (Wind noise) (p 474-489)

Wind noise reduction (wind protection) (p 51, 164, 479-489)

Wind tests (p 477, 570)

Word error rate (WER) (p 145, 308)

Wrist band (ESD) (p 543)

XY stereo pair (p 352)

Yield (production / manufacturing yield) (p 93, 273-274, 279, 291-292, 299, 312, 424, 496, 498, 524, 576)